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In this paper, we modeled and simulated uneven current distribution foron-die interconnect structure. We show significant difference when consideringuneven current distribution. Finite Element Method approach is used to analyzevarious variation effects. Blech length effect and analytical EM lifetimecalculation is used to quickly identify on-die EM weak wires. We propose arandom walk based approach to evaluate on-die variation impact onelectromigration reliability. Experimental results show substantial EMdegradation with variation effects present.

Uneven Current Distribution Modeling and Random Walk based Variation Analysis for interconnect Electromigration Estimation