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The effect of substrate was studied using nanoindentation on thin films. Softfilms on hard substrate showed more pile up than usual which was attributed tothe dislocation pile up at the film substrate interface. The effect of tipblunting on the load depth and hardness plots of nanoindentation was shown. Theexperimental date of variation of Vickers hardness with film thickness andloads were fitted and new parameters were analyzed. The delaminated area wasanalyzed using geometrical shapes using optical view of the failure regionalong with the load displacement Indentation fracture using Nanoindentationusing Berkovich indenter has been studied. Indentation fracture toughness (KR)was analyzed based on computational programs. The contact mechanics duringnanoindentation was studied with parameters related to indenter shape and tipsharpness. Elastic, plastic and total energies were computationally determined.The energy difference was related to shear stress being generated with elasticto plastic transition. Change in the nature of residual stress was related tofilm thickness.

Substrate effect and nanoindentation fracture toughness based on pile up and failure