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High velocity impact between crystalline surfaces is important for a range ofmaterial phenomena, yet a fundamental understanding of the effect of surfacestructure, energetics and kinetics on the underlying thermo-mechanical responseremains elusive. Here, we employ non-equilibrium molecular dynamics (NEMD)simulations to describe the nanoscale dynamics of the high velocity impactbetween commensurate and incommensurate monocrystalline (001) copper surfaces.For impact velocities in the range 100-1200 m/s, the kinetic energy dissipationinvolves nucleation and emission of dislocation loops from defective siteswithin the rapidly forming interface, well below the bulk single-crystal yieldpoint. At higher velocities, adiabatic dissipation occurs viaplasticity-induced heating as the interface structurally melts following theimpact. The adhesive strength of the reformed interface is controlled by theformation and nucleation of dislocations and point defects as they modify theinterfacial energy relative to the deformed bulk. As confirmation, the excessinterface energy decreases monotonically with increasing impact velocity. Therelative crystal orientation of the surfaces equally important; the grainboundaries formed following incommensurate impact exhibit higher impactresistance, with smaller defect densities and interfacial enthalpies,suggesting an enhanced ability of the grain boundaries to absorb thenon-equilibrium damage and therefore facilitate particle bonding. Our studyhighlights the key role played by the atomic-scale surface structure indetermining the impact resistance and adhesion of crystalline surfaces.

Interface-mediated thermomechanical effects during high velocity impact between monocrystalline surfaces