English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Limited memory bandwidth is a critical bottleneck in modern systems.3D-stacked DRAM enables higher bandwidth by leveraging widerThrough-Silicon-Via (TSV) channels, but today's systems cannot fully exploitthem due to the limited internal bandwidth of DRAM. DRAM reads a whole rowsimultaneously from the cell array to a row buffer, but can transfer only afraction of the data from the row buffer to peripheral IO circuit, through alimited and expensive set of wires referred to as global bitlines. In presenceof wider memory channels, the major bottleneck becomes the limited datatransfer capacity through these global bitlines. Our goal in this work is toenable higher bandwidth in 3D-stacked DRAM without the increased cost of addingmore global bitlines. We instead exploit otherwise-idle resources, such asglobal bitlines, already existing within the multiple DRAM layers by accessingthe layers simultaneously. Our architecture, Simultaneous Multi Layer Access(SMLA), provides higher bandwidth by aggregating the internal bandwidth ofmultiple layers and transferring the available data at a higher IO frequency.  To implement SMLA, simultaneous data transfer from multiple layers throughthe same IO TSVs requires coordination between layers to avoid channelconflict. We first study coordination by static partitioning, which we callDedicated-IO, that assigns groups of TSVs to each layer. We then provide asimple, yet sophisticated mechanism, called Cascaded-IO, which enablessimultaneous access to each layer by time-multiplexing the IOs. By operating ata frequency proportional to the number of layers, SMLA provides a higherbandwidth (4X for a four-layer stacked DRAM). Our evaluations show that SMLAprovides significant performance improvement and energy reduction (55%/18% onaverage for multi-programmed workloads, respectively) over a baseline3D-stacked DRAM with very low area overhead.

Simultaneous Multi Layer Access: A High Bandwidth and Low Cost 3D-Stacked Memory Interface