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Electron beam lithography (EBL) is a promising maskless solution for thetechnology beyond 14nm logic node. To overcome its throughput limitation,industry has proposed character projection (CP) technique, where some complexshapes (characters) can be printed in one shot. Recently the traditional EBLsystem is extended into multi-column cell (MCC) system to further improve thethroughput. In MCC system, several independent CPs are used to further speed-upthe writing process. Because of the area constraint of stencil, MCC systemneeds to be packed/planned carefully to take advantage of the characters. Inthis paper, we prove that the overlapping aware stencil planning (OSP) problemis NP-hard. To solve OSP problem in MCC system, we present a tool, E-BLOW, withseveral novel speedup techniques, such as successive relaxation, dynamicprogramming, and KD-Tree based clustering. Experimental results show that,compared with previous works, E-BLOW demonstrates better performance for bothconventional EBL system and MCC system.

E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System