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The increasing complexity of photonic integrated circuits requires thepossibility to monitor the state of the circuit in order to stabilize theworking point against environmental fluctuations or to perform reliablereconfiguration procedures. Although InP technologies can naturally integratehigh-quality photodiodes, their use as tap monitors necessarily affects thecircuit response and is restricted to few units per chip. They are henceunsuited for very large circuits, where transparent power monitors become keycomponents. In this paper we present the implementation of a ContactLessIntegrated Photonic Probe (CLIPP) realizing a non invasive integrated lightmonitor on InP-based devices. We describe an innovative vertical scheme of theCLIPP monitor which exploits the back side of the chip as a common electrode,thus enabling a reduction of the device footprint and a simplification of theelectrical connectivity. We characterize the response of the CLIPP anddemonstrate its functionality as power monitor. Lastly, we provide a directdemonstration that CLIPP monitor allows to access more accurate information onthe working point of photonic integrated circuits compared to conventionalexternal or integrated photodetectors.

ContactLess Integrated Photonic Probe for light monitoring in InP-based devices