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The room temperature liquid metal related electronics has been foundimportant in a wide variety of emerging areas over the past few years. However,its failure features under high electrical current densities are not clearuntil now. Here we show that a liquid metal thin film would break-up as theapplied current increases to a critical magnitude. The break-up phenomenon isattributed to be caused by the so-called electromigration effect. This problemcould be one of the major hurdles that must be tackled with caution in theresearch and application of future liquid metal film electronics.

Break-up phenomena of liquid metal thin film induced by high electric current