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Acquiring a portable high density charged particles trap might consist of anarray of micro-Penning-Malmberg traps (microtraps) with substantially lower endbarriers potential than conventional Penning-Malmberg traps [1]. We report onthe progress of the fabrication of these microtraps designed for antimatterstorage such as positrons. The fabrication of large length to radius aspectratio (1000:1) microtrap arrays involved advanced techniques includingphotolithography, deep reactive ion etching (DRIE) of silicon wafers to achievethrough-vias, gold sputtering of the wafers on the surfaces and inside thevias, and thermal compression bonding of the wafers. This paper describes theencountered issues during fabrication and addresses geometry errors andasymmetries. In order to minimize the patch effects on the lifetime of thetrapped positrons, the bonded stacks were gold electroplated to achieve auniform gold surface. We show by simulation and analytical calculation that howpositrons confinement time depends on trap imperfections.

Fabrication of High Aspect Ratio Micro-Penning-Malmberg Gold Plated Silicon Trap Arrays