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Fracture material is seriously problem in daily life, and it has connectionwith mechanical properties itself. The mechanical properties is belief dependon dislocation movement and crack propagation in the crystal. Information aboutthis is very important to characterize the material. In FCC crystal structurethe competition between crack propagation and dislocation wake is veryinteresting, in a ductile material like copper (Cu) dislocation can be seen inroom temperature, but in a brittle material like Si only cracks can be seenobserved. Different techniques were applied to material to study the mechanicalproperties, in this study we did compression test in one direction. Combinationof simulation and experimental on cubic material are reported in this paper. Wefound that the deflection of crack direction in Si caused by vacancy oflattice,while compression stress on Cu cause the atoms displacement in onedirection. Some evidence of dislocation wake in Si crystal under compressionstress at high temperature will reported.

Compression Stress Effect on Dislocations Movement and Crack propagation in Cubic Crystal