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We present the results of the characterization of pixel modules composed of75 um thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID(Solid Liquid Inter-Diffusion) technology. This technique, developed atFraunhofer-EMFT, is explored as an alternative to the bump-bonding process.These modules have been designed to demonstrate the feasibility of a verycompact detector to be employed in the future ATLAS pixel upgrades, making useof vertical integration technologies. This module concept also envisagesInter-Chip-Vias (ICV) to extract the signals from the backside of the chips,thereby achieving a higher fraction of active area with respect to the presentpixel module design. In the case of the demonstrator module, ICVs are etchedover the original wire bonding pads of the FE-I3 chip. In the modules with ICVsthe FE-I3 chips will be thinned down to 50 um. The status of the ICVpreparation is presented.

SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades