English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

With the new and upcoming technologies in semiconductor industry, packages like the ball grid array (BGA) are getting more challenging to process due to inherent issues that come along. Process improvement through modification in the design of indirect material is one key direction to improve the productivity during assembly manufacturing. In this paper, an enhanced design of dipping plate is presented to solve the issue of flux shorting due to out-of-specs dipping plate at ball attach process. The study used a side by side comparison to prove that the new design is better than that of the out-of-specs indirect material. With the new enhanced design of dipping plate and the optimized flux depth parameter, flux shorting occurrence was successfully mitigated.

Flux Shorting Mitigation on Semiconductor BGA Device through Process Design Enhancement