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One of the most challenging assembly manufacturing process in semiconductor industry is wirebond process using a wire as direct material. With this new technology, some issues were encountered during the first trial of a quad flat no-leads (QFN) package. This paper is focused on the heal crack seen on the stitch formation during second bond. A comprehensive improvement was done by relocating the stitch formation on the second bond. Ultimately, heal crack occurrence was successfully eliminated.

Wirebond Process Optimization through Stitch Relocation on QFN Package