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Burn-in is usually carried out with high temperature and elevated voltage. Since some of the early-life failures depend not only on high temperature but also on temperature gradients, simply raising up the temperature of an IC is not sufficient to detect them. This is especially true for 3D stacked ICs, since they have usually very large temperature gradients. The efficient detection of these early-life failures requires that specific temperature gradients are enforced as a part of the burn-in process. This paper presents an efficient method to do so by applying high power stimuli to the cores of the IC under burn-in through the test access mechanism. Therefore, no external heating equipment is required. The scheduling of the heating and cooling intervals to achieve the required temperature gradients is based on thermal simulations and is guided by functions derived from a set of thermal equations. Experimental results demonstrate the efficiency of the proposed method.

An efficient temperature-gradient based burn-in technique for 3D stacked ICs