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ZnS:Cu thin films were prepared at 440 ◦C by sulfuring Zn:Cu thin films which were grown by magnetron sputtering with zinc targets covered with different areas of copper foil to vary the Cu content. As the area of copper increases, the morphology of the ZnS:Cu thin films becomes more uniform and dense. Owning to lower mobility of copper atoms that inhibit the mass aggregation of zinc, the aggregation in Zn:Cu films gradually disappears. After sulfuring the thin films with higher copper content, the concentration of both surface-holes and defects decreases. Annealing the prefabricated Zn:Cu thin films can improve the quality of ZnS:Cu thin films. Notably, the increasing Cu content contributes more to the quality of ZnS:Cu thin films than annealing. Among the samples with increasing cooper content, the defects in the thin films tends to be of only one type.

Influence of copper content and pre-treatment on the structure of ZnS : Cu thin films by sulfidation