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Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at 85C/85% for 500 hours, TC (temperature cycling) test at –40~100C for 1,000 cycles, and HTS (high temperature storage) test at 155C for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was 0.56±0.05 Ω and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.

Reliability Characteristics of a Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test