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Warpage analysis has been performed for top and bottom packages of thin package-on-packages processed with different epoxy molding compounds (EMCs). Warpage deviation was measured for packages molded with the same EMCs and also the warpage deviations of top and bottom substrates themselves were characterized in order to identify the major factor causing the package warpage. For the top and bottom packages processed with thin substrates, the warpage deviation of the substrates was large, which made it difficult to figure out the effect of EMC properties on the package warpage. Top packages, where the molding area of 13 mm×13 mm covered the most of the substrate area (14 mm×14 mm), exhibited similar warpage behavior with changing the temperature. On the other hand, bottom packages, where the molding area was only 8 mm×8 mm, exhibited the complex warpage behavior due to simultaneous occurrence of (+) and (−) warpages on the same package. Accordingly, the bottom packages showed dissimilar temperature-warpage behavior even being processed with the same EMCs.

Warpage Analysis for Top and Bottom Packages of Package-on-Package Processed with Thin Substrates