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Dept. of Mechanical System Design Eng., Seoul National University of Science and Technology, 232 Gongreung-ro, Nowon-gu, Seoul 139-743, Korea(2014 9 19 : 2014 9 25 : 2014 9 29  ):  3    Cu TSV     . Cu TSV                  .                 . TSV         ,  Cu TSV        Cu TSV     .Abstract: In this study, we investigated the effects of Cu TSV on the thermal management of 3D stacked IC.Combination of backside point-heating and IR microscopic measurement of the front-side temperature showed evolutionof hot spots in thin Si wafers, implying 3D stacked IC is vulnerable to thermal interference between stacked layers. CuTSV was found to be an effective heat path, resulting in larger high temperature area in TSV wafer than bare Si wafer,and could be used as an efficient thermal via in the thermal management of 3D stacked IC. Keywords: thermal via, 3D stacked IC, Cu TSV, thermal management

The Effects of Cu TSV on the Thermal Conduction in 3D Stacked IC