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,     .    (wafer level package, WLP) fan-in , I/O      .     (fan-out wafer level package, FOWLP)    . FOWLP      (warpage) ,  FOWLP     ,        .          .   FOWLP           .     epoxy mold compound (EMC)         .  FOWLP   EMC  ,   (detachment)      .  , EMC        EMC CTE, EMC CTE  Tg()     .   Alloy42     ,  ,  ,      Alloy 42  SUS     .Abstract: For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization,lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement.The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLPtechnology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditionalIC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yieldof the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigatedthe characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finiteelement numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy moldcompounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpageafter EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate thatthe most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg(glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore,considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material. Keywords: Fan-out package, Wafer level package, Numerical simulation, Warpage, Reliability

Numerical Analysis of Warpage and Reliability of Fan-out Wafer Level Package