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Plastic ball grid array (PBGA)       .      PCB      underfill  .           ,   (acceptance level)  (qualification level)   power spectrum density 22.7 Grms 32.1 Grms.  underfill      ,             . Abstract: Experimental analyses on the solder joint reliability of plastic ball grid array under harsh random vibrationwere presented. The chips were assembled on the daisy chained circuit boards for the test samples preparation, half ofwhich were processed for underfill to investigate the underfill effects on the solder failures. Acceptance and qualificationlevels were applied for the solder failure tests, and the overall controlled RMS of the power spectrum densities of thesteps were 22.7 Grms and 32.1 Grms, respectively. It was found that the samples survived without any solder failure duringthe tests, demonstrating the robustness of the packaging structure for potential avionics and space applications. Keywords: PBGA; Reliability, Random vibration, Solder failure

Experimental Assessment of PBGA Packaging Reliability under Strong Random Vibrations