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Thermal annealing tests were performed in an in-situ scanning electron microscope chamber at 130C, 150C, and 170C in order to investigate the effects of solder structure on the growth kinetics of intermetallic compound (IMC) in Cu/Sn-3.5Ag microbump. Cu/Sn-3.5Ag(6 μm) microbump with spreading solder structure showed Cu6Sn5 and Cu3Sn phase growths and then IMC phase transition stages with increasing annealing time. By the way, Cu/Sn-3.5Ag(4 μm) microbump without solder spreading, remaining solder was transformed to Cu6Sn5 right after bonding and had only a phase transition of Cu6Sn5 to Cu3Sn during annealing. Measured activation energies for the growth of the Cu3Sn phase during the annealing were 0.80 and 0.71eV for Cu/Sn-3.5Ag(6 μm) and Cu/Sn-3.5Ag(4 μm), respectively.

Effect of Solder Structure on the In-situ Intermetallic Compounds growth Characteristics of Cu/Sn-3.5Ag Microbump