English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Department of Mechanical engineering, Dongyang Mirae University, Seoul 152-714, Korea(Received December 12, 2012: Corrected June 5, 2013: Accepted June 19, 2013)Abstract: In this study, both a finite element analysis and an experimental analysis are executed to investigate themechanical characteristics of dielectric material effects on warpage. Also, viscoelastic material properties are measuredby DMA and are considered in warpage simulation. A finite element analysis is done by using both thermal elastic analysisand a thermo-viscoelastic analysis to predict the nonlinear effects. For experimental study, specimens warpage of non-symmetric structure with body size of 22.5×22.5 mm, 37.5×37.5 mm and 42.5×42.5 mm are measured under the reflowtemperature condition. From the analysis results, experimental warpage is not similar to FEA results using thermal elasticanalysis but similar to FEA results using thermo-viscoelastic analysis. Also, its effect on substrate warpage is increasedas core thickness is decreased and body size is getting larger. These FEA and the experimental results show that thenonlinear characteristics of dielectric material play an important role on substrate warpage. Therefore, it is stronglyrecommended that non-linear behavior characteristics of a dielectric material should be considered to control warpage ofFCBGA substrate under conditions of geometry, structure and manufacturing process and so on.Keywords: Nonlinear behavior, dielectric, warpage, FCBGA substrate, FEM

Study on the Nonlinear Characteristic Effects of Dielectric on Warpage of Flip Chip BGA Substrate