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Recently, the heat exchangers are requiring higher performance and reliability since they are being used under theoperating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bondingtechnology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength,and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of 1200 ℃ , and 50 tons was found to be suitable for this heat exchanger.From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger throughthe application of the diffusion bonding.

A Study of Diffusion Bonding Process for High Temperature and High Pressure Micro Channel Heat Exchanger Using Inconel 617