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FRPs, reinforced with carbon fiber, SiC fiber and glass fiber, were prepared by using a new thermosetting polymer containing silicon, poly[(phenylsilylene) ethynylene-1, 3-phenyleneethynylene], as a matrix and the characteristics of the FRPs were investigated. The fobrication process has some advantages, such as no need of solvent, no by-products, and low curing temperature (150-210°C). For the FRPs, high heat-, burn- and radiation-resistant properties were obtained. Bending strengths (110-140 MPa) as well as moduli (30 GPa) at room temperature, 200°C, and 400°C were observed to be almost equal respectively, and no change even at 100 MGy of irradiation. Dynamic viscoelasticity and creep of the FRPs were also measured and compared with those of the FRP with polyimide matrix.

Fiber Reinforced Composites with a New Heat-Resistant Polymer Matrix Containing Silicon.