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In joining Alumina to copper plate by Mo-Mn metallizing process, the effects of the composition of metallizing paste on the bonding strength were investigated. The bonding strength increased with increasing Mn amount in the paste up to 20% but followed by the decrease with addition of Mn. The maximum bonding strength reached 50MPa at 20%Mn when heated to 1550℃ for 60minute. The addition of Si to the metallizing powder increased the bonding strength of the joint by enhancing the mechanical bonding between the Alumina and the metallizing layer due to the decrease of layer viscosity with the addition of SiO 2 . It is thought that MnO reacted with Al 2 O 3 to yield MnAl 2 O 4 spinel, forming a joint.Key Words : Brazing, Metallizing, Bonding, Al 2 O 3 , Ceramic 1.   ,                  .       PCB               .    ,   (IGBT),  (LED),     forsterite, steatite, beryllia    ,     .                 ,            .     Brazing, Diffusion bonding, Eutetic bonding, Metallizing( MLZ)             .  MLZ            MLZ

The Effect of the Composition of Metallizing Paste on the Bonding Strength in the Joining of Al2O3/Cu to Cu

The Effect of the Composition of Metallizing Paste on the Bonding Strength in the Joining of Al₂O₃/Cu to Cu