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Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, Cr 6+ ) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead- free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.Key Words : Automotive, Electronic control unit, Lead-free, Solder joint, Degradation, Whisker, Reliability

Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics