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Moore   ,  LSI       2-3 4   ,   .     11 nm node    (Leakage Current) ,   ,          ,       .       , LSI  , MEMS (Mechanical- electrical micro system)          .          (Three-dimensional Integration) .  (3-D IC)              .         ,   ㎛      (TSV ; Through-Silicon Via)         (3-D IC)    ,

High Speep/High-Precision Chip Joining Using Self-Assembly Technology for Three-Dimensional Integrated Circuits