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By the trends of electronic package to be high performance and high integrative, build-up printed circuit boards (PCBs) are required to be highly integrated circuits and highly reliable circuits. PCBs are subjected to varying temperature and moisture exposures throughout whole their lives. This paper reports on the lifetime predictions of printed circuit boards under biased highly accelerated stress testing (HAST). In the failure analysis, it is found that porous CuxO colloids and Cu dendrites were formed at anode (+) trace and at cathode (-) trace, respectively. It is clear that the failure mechanism of the test legs is Cu corrosion, Cu ionmigration, and Cu metallization between a couple of test traces. The median lives of the test legs were calculated by the log-normal distribution. Based on the failure mechanism, the lifetime model for temperature and humidity stress is assumed to be a modified Peck model. We obtained the lifetime’s equation using the time to failure of the biased HAST, the median lifetime in the user condition was calculated as 19,321 years and 95% confidence interval (42876.9, 8706.7).

Lifetime Predictions of Printed Circuit Boards under Biased HAST