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The chapter deals with Sn and Bi-In-based lead-free solders. The term “active solders” is used for the solders which contain one or more elements with enhanced affinity to some element contained in the substrate material. Mainly, Ti, In, lanthanides, etc. belong amongst the active metals. The role of an active element is to ensure a good wetting by a reactive decomposition of the surface layer of substrate. The perspective solders for joining the combined materials, as ceramics/metal, are mainly the tin-based, lead-free solders, which are enriched with titanium (usually up to 4 wt. %). The advantage consists in the fact that they offers a sufficient plasticity reserve, by what they are capable to compensate undesired residual stresses formed in the joint. Titanium also reacts with carbon, nitrogen or oxygen of the ceramic material, eventually it forms the intermetallic phases, which increase the strength of joint interface. The Sn-Ti, Sn-Ag-Ti and Bi-In-Sn solders were selected for the experiments. These solders were applied for fabrication of Al2O3 ceramics/Cu joints. The phase composition and microstructure of solders and soldered joints was analysed. Interactions in the interface of ceramic/solder and Cu substrate/solder were determined. The shear strength of soldered joints was measured

Soldering by the Active Lead-Free Tin and Bismuth-Based Solders