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The electronics industry has been striving to find a suitable replacement for lead-based, SnPb solder paste after introduction of legislation to ban the use of lead in electronic products. Due to the toxicity of lead in electronic products, legislation has been proposed to reduce the use of and even ban lead from electronics. Lead-free solders (Pb-free solders) and isotropic conductive adhesives (ICAs) have been considered as the most promising alternatives of lead-based solder [1-2]. ICAs offer numerous advantages over conventional solder, such as environmental friendliness, low temperature processing conditions, fewer processing steps, low stress on the substrates, and fine pitch interconnect capability. Therefore, ICAs have been used in liquid crystal display (LCD), UHF RFID tag antennas, smart card applications, flip–chip assembly and ball grid array (BGA) applications as a replacement to solder [3].

Rheological Characterisation of Diglycidylether of Bisphenol-A (DGEBA) and Polyurethane (PU) Based Isotropic Conductive Adhesives