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The TLP bonding is distinguished from brazing processes by the isothermal solidification of this liquid. This is accomplished since the interlayer is rich in a melting point depressant (MPD). Upon heating through the eutectic temperature, the interlayer will either melt or react with the base metal to form a liquid. During the hold time above the melting temperature, the melting point depressant (solute) into the base metal (solvent). This resulting solid/liquid interfacial motion via epitaxial growth of the substrate is termed ‘‘isothermal solidification.’’ A homogeneous bond between the substrates is formed when the two solid/liquid interfaces meet at the joint centerline marking the end of the isothermal solidification stage.

Spectroscopic Analyses of Nano-Dispersion Strengthened Transient Liquid Phase Bonds