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Low Temperature Co-fired Ceramic (LTCC) technology has attracted much attention for high frequency applications due to the advantages in preparing 3D circuits within a ceramic block that enables burying of passive elements; resistor, inductor and capacitor (Jantunen et al., 2003). This technology also offers another advantages such as low fabrication cost due to parallel process, utilizing high conducting metal, higher interconnect density, high performance thermal management system, shrinking of circuit dimensions and high level of passive integration (Lin and Jean, 2004; Gao et al., 2010). The LTCC multilayer technology process generally consists of cutting the green tape ceramic into the required dimension, via punching, via filling, screen printing, stacking, lamination and co-firing process. All these steps are important to achieve a good quality of the final structure. Furthermore, LTCC technology requires cofiring process of conductor and ceramic-glass substrate. The co-firing mismatch should be avoided to make sure the resulting product has good appearance. The key point of LTCC technology is the screen printing process of thick-film technology which strongly depends on the optimization of the conductor paste rheological behavior. Besides, the characteristics and the quality of printed conductor lines are greatly affected by some process variables such as screen printing speed, angle and geometry of the squeegee, snapoff and screen mesh parameter including the paste characteristics (Hoornstra et al., 1997; Yin et al., 2008). The performance of the paste depends on the variety of factors including storage, how easily and accurately it can be deposited (printing) and the flow characteristics (rheology) (Nguty and Ekere, 2000). Thick-film paste must maintain good printability throughout the time on the screen and the screen parameters must allow for high throughput and repeatability results (Harper, 2001; Buzby & Donie, 2008). The successful story of making multilayer substrate is depends on this steps. Consequently, a thorough understanding of the influence of the paste rheological behavior and the combination with other parameters is essential if this objective is to be met.

Rheological Behaviors and Their Correlation with Printing Performance of Silver Paste for LTCC Tape