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Micro Electro Mechanical Systems (MEMS) is developed based on the semi-conductor technology, however, relative material, design, fabrication, simulation, packaging and test are more complex than those in semi-conductor technology. In the primary stage, MEMS technology focused on the design and development, now on the commercialization and improving reliability and decreasing cost and price. So test is increasingly important to MEMS technology and testing cost is about 1/3 of the whole cost of MEMS. In order to improve the production and decrease the cost, producers and researchers pay more attention to MEMS test to solve all the testing problems from design to packaging process. There are a number of methods to carry out these measurements, such as scanning electron microscopy (SEM), atomic force microscopy (AFM), stylus profiler, and optical profiler, etc. Every method has its advantages and disadvantages.  SEM is one of the most common measurement tools. However, nearly all nonconductive specimens examined using SEM need to be coated with a thin film of conducting material. This may result in bending or distortion of the device, especially where free structures such as cantilever beams. SEM tests are also time consuming and not suitable for a production environment.  AFM has been suggested as a MEMS measurement tool. As with SEM, analysis may be slow (about 20 min/device), and the limited measurement range of an AFM (100 ┤m×100 ┤m×5 ┤m, Veeco multimode AFM) means that it is unable to investigate large samples or out-of-plane devices such as the cantilevers. It is also difficult to examine packaged devices using an AFM.  Mechanical stylus surface profilers are commonly used for dimensional measurements in MEMS. While these can measure step heights with a high accuracy, they are not suitable for the analysis of freestanding structures, where the stylus may break the device under test. Deep, high aspect ratio devices also pose problems, as the stylus probe may be too large to accurately reproduce the surface profile. If MEMS devices need to fit the large-scale production, it is essential that these measurements must be cheaply and easily made at the wafer level, without the need for large space, expensive packaging or destructive test methods. Optical techniques can offer

MEMS Characterization Based on Optical Measuring Methods