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Some of the high-end applications in energy-related topics such as electronics, aeronautics and research in elementary particles have reached their technological limits because of the impossibility of finding materials capable of removing the excessive heat generated in running their equipments and, at the same time, maintaining their dimensional stability in environments often extremely aggressive, namely, wide temperature range of use (218423K), corrosive environments (>98% humidity), fast heating-cooling cycles or interaction with accelerated particles. The growing needs for thermal control are a consequence of the unlimited increasing power consumption in the operation of their equipments. These applications, that exclude the use of monolithic materials given their required unique combination of properties, force the use of composite materials that exhibit high heat transport and, at the same time, do maintain their dimensional stability under operational conditions. Despite the significant progress in the development of composite materials for these applications in recent years, nowadays there is a need to find new materials capable of withstanding the extreme conditions that are impingingly demanded for the new heat sinks. Power electronics and optoelectronics demand thermal conductivities (TC) above 350 W/mK and 450 W/mK respectively; aeronautics is less demanding (>250 W/mK). The coefficients of thermal expansion (CTE) should be matched to those of the architectures on which they are mounted to prevent failures by thermo-mechanical fatigue (it is required 3-6 ppm/K for optoelectronics and less than 12 ppm/K for power electronics, both in the 293500K range, and 10-14 ppm/K in the range 233-344 K for aeronautics). In applications such as collimators in particle accelerators, apart from a great resistance to radiation damage, materials with more than 300 W/mK of CT and approximately 10-12 ppm/K of CTE are needed. All applications require isotropic materials with a flexural strength of >120 MPa and the lowest possible density, especially those for aeronautics. SiC-based metal matrix composite materials have shown, up to now, a perfect combination of properties such that to cover the increasing demanding of the energy-related industries. Among them, Al/SiC has become a leader material and nowadays is considered the state-ofthe-art in thermal management. This material, in which SiC is present as particulate, cannot meet the future requirements for heat dissipation and dimensional control given its limited thermal conductivity (about 180 W/mK) and relatively high coefficient of thermal

SiC as Base of Composite Materials for Thermal Management