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The objective of this study is to numerically investigate the cooling characteristics of the heat sink as a cooling device for the amplifier. In order to analyze the heat transfer performances of the heat sink, the steady-state thermal model of the ANSYS software was used and analyzed with the fin thickness, fin pitch and fin number of the heat sink. As a result, the temperature at the junction of heat sink was decreased with the increase of fin thickness and fin number. In addition, the thermal resistances of the heat sinks were enhanced from 0.764C/W to 0.739C/W and 1.254C/W to 0.610C/W, respectively, with the increase of the fin thickness from 1 mm to 3 mm and fin number from 9 to 20, respectively.

Numerical Analysis on Cooling Characteristics of the Heat Sink for Amplifier