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As the wire bonding process has been converted into BUMP process due to the high density integrationof semiconductor chip, the telecommunication line connecting to semiconductor chip and external devices have become finer. As a result, a more precise work is necessary. However, it is difficult to control quantity given the nature of high viscosity of PSPI and the yield rate continues to decline due to the inflow of bubble. Therefore, this paper developed the D&P(degassing and pumping) system to remove and supply gas that is generated from coating the high viscosity photosensitive polyimide(PSPI) in the semiconductor BUMP process. Key Words : Degassing, Chemical Pumping, Photosensitive Polyimide, BUMP   2014     . * Corresponding Author : Hyoung-Keun Park(Namseoul Univ.)Tel: +82-41-580-2118 email: phk315@nsu.ac.krReceived October 7, 2014 Revised January 19, 2015 Accepted February 12, 2015 1.             BUMP                PSPI            .  (FPD)      ()                .[1,2]    BUMP    (PSPI : Photosensitive Polyimide) (coating)  (gas)   D&P(Degassing and Pumping)     . , PSPI        (real-time)             (unit)

A Study on the High Viscosity Photosensitive Polyimide Degassing and Pumping System