English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The cause of defects in the PCB SMT assembly is mostly solder paste deposits. Conventional inspection methods for solder paste deposits suffer from slow speed, low reliability and high cost. Therefore, this paper proposes a method for calculating the height and region of solder paste on PCB using the 3D profiles without measuring the 2D image. The solder paste region is detected by the phase difference in the measurement points and the average phase on the whole surface of PCB. The high reliable height of the solder paste region is computed by the average of the measurement points' phase with repeatability and reliability. The experimental results revealed improvements of 17% in inspection time and 29% repeatability in the height calculation of the solder paste region, resulting in a high speed and less expensive system.

Solder Region Detection and Height Calculation by the Characteristics and Phase Difference of the 3D Profiles in Moire Images