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In this paper, we designed and manufactured HD Switch Panel parts with micro-etched pattern. By using CAE analysis, we could predict weld-line positions and the amount of shrinkage during injection molding process. We measured the temperature distribution of the mold surface so that we could optimize the processing conditions such as mold temperature. In order to increase the transcription of micro-etched pattern, we applied the E-Mold technology and evaluated the effect of mold temperature on the surface quality. We concluded that the etched pattern was improved(more than 2.51.5~1.7) through the measurement of surface gloss and the observation of both SEM and SPM images.

Development and transcription estimation of an automotive interior plastic part(HD Switch Panel) with no glossy etching pattern