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Epoxy resin nanocomposites based on 3,3’, 5,5’ -4,4’ tetramethylbiphenyl  diglycidyl epoxy resins (TMBP) were prepared through in situ co-polymerization with 4, 4’-diaminodiphenylsulfone (DDS) in the presence of octapropylglycidylether silsesquioxane (OGPOSS). The thermal properties of the TMBP/OGPOSS nanocomposite were analyzed by DSC and TGA. The glass transition temperature (T<sub>g</sub>) increased with increasing OGPOSS content. Additionally, the integrity of the epoxy networks was also demonstrated by thermal decomposition which occurred in one-step. The dielectric constant decreased with the increase of OGPOSS content. The morphology of TMBP/OGPOSS hybrids was characterized by Scanning Electron Microscopy (SEM)

Dielectric and Thermal Properties of Epoxy Resin Nanocomposites Containing Polyhedral Oligomeric Silsesquioxane