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This dissertation presents two fully-integrated 122 GHz radar System-inPackages (SiPs) in Low Temperature Co-fired Ceramic (LTCC) technology. In both SiPs, an active radar chip is integrated with LTCC-based passive components including antennas, signal transitions and a low frequency package base. The millimeter-wave interconnects between the radar chip and the LTCC-based circuitry are realized through standard half-wavelength wirebonds and the SiPs are encapsulated with an epoxy molding compound, namely, Polytec TC 430-T, which has a well-defined relative permittivity and a relatively low loss tangent in the frequency range of 110 to 170 GHz. The LTCC SiPs are surface-mounted on baseband printed circuit boards, thus building two fully-functional 122 GHz radar sensors, whose functionalities are successfully tested by measuring the distance of a standard target. The performance of one of these radar sensors shows an improvement over a commercial 122 GHz radar sensor. In addition, the LTCC SiPs shown in this work are compact, low-cost and require only standard package assembly steps. In Chapter 1, the primary factors, which lay the foundation for a fullyintegrated millimeter-wave system are defined. Thereafter, the target and workflow of this dissertation are specified. In Chapter 2, the standard LTCC manufacturing process as well as state-of-the-art LTCC manufacturing techniques are presented. The manufacturing defects, commonly observed in an LTCC module, e.g., shrinkage, layer misalignment and warping, are discussed. A suitable LTCC substrate is selected for this work and two LTCC-based SiP concepts are proposed after taking the LTCC capabilities

Low Temperature Co-fired Ceramic for System-in-Package Applications at 122 GHz