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Abstract. With the rapid development of nanotechnology,the size of a device reaches sub-nanometer scale. The larger resistivity of interconnect leads to serious overheating of integrated circuits. Silicon-based electronic devices have also reached the physical limits of theirdevelopment. The use of carbon nanotubes instead of traditional wires hasbecome a new solution for connecting nano-structures. Nanocluster particlesserving as brazing material play an important role in stabilizing theconnection of carbon nanotubes, which places higher demands for nanoscalemanipulation techniques. In this paper, the dynamic processes underdifferent operating scenarios were simulated and analyzed, including probe propulsion nanoparticle operation, probe pickup nanoparticle operation and probe pickup nanocluster particle operation. Then, the SEM (ScanningElectron Microscope) was used for nanoparticle manipulation experiments. Thesmallest unit of carbon nanotube wire was obtained by three-dimensional (3D)construction of a carbon nanotube–silver nanocluster particle (CN-AgNP), which verified the feasibility of 3D manipulation of carbon nanotube wire construction. The experiments on the construction of carbonnanotube–nanocluster particle structures in three-dimensional operation were completed, and the smallest unit of carbon nanotube wire was constructed.This nano-fabrication technology will provide an efficient and maturetechnical means in the field of nano-interconnection.

Simulation and fabrication of carbon nanotube–nanoparticle interconnected structures