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Flexible electronics represents an emerging technology with features enabling\udseveral new applications such as wearable electronics and bendable displays.\udPrecise and high-performance sensors readout chips are crucial for high\udquality flexible electronic products. In this work, the design of a CMOS\udreadout circuit for an array of printed strain gauges is presented. The\udultra-thin readout chip and the printed sensors are combined on a thin\udBenzocyclobutene/Polyimide (BCB/PI) substrate to form a Hybrid System-in-Foil\ud(HySiF), which is used as an electronic skin for robotic applications. Each\udstrain gauge utilizes a Wheatstone bridge circuit, where four Aerosol\udJet® printed meander-shaped resistors form a\udfull-bridge topology. The readout chip amplifies the output voltage\uddifference (about 5 mV full-scale swing) of the strain gauge. One challenge\udduring the sensor interface circuit design is to compensate for the\udrelatively large dc offset (about 30 mV at 1 mA) in the bridge output\udvoltage so that the amplified signal span matches the input range of an\udanalog-to-digital converter (ADC). The circuit design uses the\ud0. 5 µm mixed-signal\udGATEFORESTTM technology. In order to achieve\udthe mechanical flexibility, the chip fabrication is based on either back\udthinned wafers or the ChipFilmTM technology,\udwhich enables the manufacturing of silicon chips with a thickness of about\ud20 µm. The implemented readout chip uses a supply of 5 V and\udincludes a 5-bit digital-to-analog converter (DAC), a differential difference\udamplifier (DDA), and a 10-bit successive approximation register (SAR) ADC.\udThe circuit is simulated across process, supply and temperature corners and\udthe simulation results indicate excellent performance in terms of circuit\udstability and linearity

Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges