English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

A concept for the fabrication of modular micro sensors on a flexible substrate is presented in this paper. For the fabrication of micro sensors on flexible polymer substrates, investigations on sacrificial layers are essential, since it must be possible to release the sensors at the end of the fabrication process. This paper describes the development and fabrication of an anisotropic magneto-resistance (AMR) sensor on a 5 μm thick SU-8TM layer, which is an epoxy-based photosensitive polymer. The micro sensor is fabricated on a standard Si wafer due to handling purposes during the sensor fabrication process. Initial investigations concentrated on the proof of the applicability of various sacrificial layer materials and the process compatibility of the respective techniques required for the removal of these layers. To investigate the suitability of a sacrificial layer process for the fabrication of modular micro sensors, Cr and SiO2 were investigated as sacrificial layer materials. Additionally, investigations on the removal of the complete Si substrate were carried out. Cr layers were fabricated within a certain thickness range by sputter deposition and electron beam evaporation. For the deposition of the SiO2 layers, a plasma enhanced chemical vapor deposition (PECVD) process was used. For the removal of the sacrificial layer with the AMR sensors on the SU-8TM foil on top, adequate processes were developed. The etching of the Si substrate was carried out wet-chemically by caustic potash (KOH). For etching the SiO2 layers, hydrofluoric acid (HF) and for Cr etching, the commercial etchant Selectipur® was used. Optimal process parameters were determined for etching the Si and SiO2 sacrificial layers, respectively.

B8.3 - Application of Sacrificial Layers for the Modular Micro Sensor Fabrication on a Flexible Polymer Substrate