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Microstructures differ from microelectronic devices by a substantial higher aspect ratio and steep slopes. This is a limiting factor for optical measurement methods. For such large aspect ratios tactile measurement is a more promising approach. But for the production of microstructures tactile measurement methods currently only have little importance because they are adapted insufficiently to their specific needs. Microstructures are produced with batch processes with the characteristics that many elements are manufactured simultaneously on the same silicon wafer. This parallelism and the fact that in general there are multiple probing points needed to describe a single feature is in marked contrast to the sequential probing of conventional tactile measurement. This causes a high expenditure of time to measure all elements of a wafer. For this reason usually only spot checks are applied. Therefore it is the objective of the presented project to probe multiple elements at the same time to reduce the overall measurement time.

P1.13 - Application of a Touch-Probe Array for the Parallel Measurement of Microstructures