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In order to achieve substantial cost reduction for far-infrared focal plane arrays (FPA), consequent adoption of existing high-volume MEMS processes is required. For that reason we used a high-volume pressure sensor process for fabrication of thermodiode FPA. While 1 st Gen FPA successfully proved the suitability of the fabrication process, performance was strongly improved for the 2 nd

2.3 - Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process