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Our work investigates the ability to integrate conductive polymer compounds as self-supporting sensitive layers in microbolometers. An appropriate technology is presented including a sacrificial layer technique and a dielectrophoretic alignment procedure of the semiconducting filler particles. The polymer matrix causes mechanical stability of the compound and can be technologically modified using standard polymer processes. The aligned filler material forms an electrically conducting network in the polymer matrix with a temperature coefficient of resistance (TCR) that yield the bolometric effect. The particle alignment allows the usage of significantly reduced amount of filler in contrast to non-aligned polymer compounds, which is advantageous for the other process steps. Investigated fillers are the semiconducting materials Tellurium (Te) and Vanadium-dioxide (VO2). The electrical properties of the sensitive compounds are discussed. In comparison to the Te-compounds, the VO2-compounds have improved noise characteristics and higher TCR-values leading to improved sensor performance.

P2 - Semiconducting Polymer Compounds as Sensitive Layer for Bolometric Applications