English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

We have developed a Si interposer with multilayer 15-μm-thick Cu wiring and SrTiO3 (STO) thin film capacitors to help create novel 3D stacked buck converters, which consist of a CMOS LSI that includes active components and a Si interposer with an LC output filter. A spiral inductor made using 15- μm-thick Cu wiring was stacked over an STO thin film capacitor in the Si interposer without any deterioration in capacitance and leakage current. A minimum line/space of 20 μm/20 μm and a minimum via-hole diameter of 30 μm were achieved to create 15-μm-thick Cu wiring patterns in the Si interposer. A newly developed chemically-amplified positive-tone resin was used as the interlayer dielectrics in the Si interposers to avoid under-exposure at the bottom of thick photo-sensitive resin and to obtain fine-pitch wiring patterns. The power efficiency of buck converters depends on the parasitic resistance of the embedded inductors. As a result, the 15-μm-thick inductor enhances the efficiency of an output current of 100 mA by 12% as compared to a 5- μm-thick inductor. The developed Si interposer with 15-μm-thick wiring layers will contribute to creating a 3D stacked buck converter for low-power and high-performance 3D integrated systems.

Si Interposers with 15-^|^mu;m-thick Spiral Inductors and SrTiO3 Thin Film Capacitors for Novel 3D Stacked Buck Converters