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To investigate a degradation of electroless copper plating bath for full additive process, the factors to affect the bath under the long time operation, especially, decrease of the formaldehyde concentration, was monitored. Each reaction decreasing the formaldehyde concentration, due to evaporation, side reactions and copper deposition, were outwardly first order reaction. Assuming that the three reactions are first order, the deposition rate for a loaded bath was calculated. The correlation between this deposition rate and mixed potential was also discussed. Then possibility of mixed potential measuring for monitoring the loaded bath condition was suggested.

Effects of formaldehyde on electroless copper plating bath for full additive process.