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A fine pattern for high frequency use has a serious problem about its RF signal loss. In order to cope with this matter, we proposed a new type of electrode applied by combination of sintering Ag and electroless plating Cu. The pattern is formed by etching a sintering Ag film, and its surface is covered with electroless plating Cu. The design rule is 30/20ƒÊm and its thickness is 10ƒÊm. Especially, it was a key point that the cross section became corner-less around shape. We found that the RF performance was affected by the thickness and the shape. We confirmed that this electrode is applicable for a new MMIC.

Structure of Fine Pattern for High Frequency Circuit and Its Application to MMIC.