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The development of the burn-in testing socket for 0.5mm pitch BGA package is a key technology for marketing of their packages. We made a new contact substrate for burn-in testing socket. The substrate was consisted of a double metal layers TAB tape carrier which had high flexibility of pattern routing. And, a lot of fine plated bumps as contact proves of solder balls were put on each pad. We also constructed a continuous reel to reel bump-plating machine for high-speed deposition and uniformity of bump height. The Durability and the reliability of the testing socket which was assembled a new tape substrate was better than that of a former 0.8mm-pitch of mechanical contact type socket.

TAB Tape Carrier with Copper Plating Bumps as Burn-in Testing Substrate for 0.5mm Pitch BGA Package.