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We previously reported on a flexible copper-clad laminate having high peel strength that was fabricated using electroless-plating of a Ni-seed layer on polyimide. However, the wiring delaminated from the polyimide surface during the circuit formation process. Alkali from the resist stripping process was observed to penetrate the Ni plating and polyimide interface, after which the Ni plating was corroded by the acidic solution causing the wiring to delaminate. The surface modified layer thickness on the polyimide formed for the electroless Ni plating was related to the penetration under the wiring by the alkali. Wire delamination could then be prevented by thinning the surface modified layer to the nanometer scale.

Investigation on Wire delamination Mechanism Made on Flexible Wiring Substrates with Electroless Nickel Plating Seed Layer